Company Profile
The company is located in Chengdu High-tech Zone, with a team of more than 30 frontline production and quality inspection staff and an annual output value exceeding 7 million RMB. It completed factory relocation and expansion in 2021, passed the qualification review as an approved supplier for numerous research institutes and universities in 2022, and was recognized as a High-tech Enterprise in 2023. Meanwhile, it obtained the GJB9001C-2017 Quality Management System Certification for Military Equipment. The company holds a total of 25 independent patented technologies, boasting complete production qualifications and R&D capabilities for military supporting projects.
Deeply Rooted in RF & Microwave, Delivering One-stop Precision Electronic Solutions
The company is located in Chengdu High-tech Zone, with a team of more than 30 frontline production and quality inspection staff and an annual output value exceeding 7 million RMB. It completed factory relocation and expansion in 2021, passed the qualification review as an approved supplier for numerous research institutes and universities in 2022, and was recognized as a High-tech Enterprise in 2023. Meanwhile, it obtained the GJB9001C-2017 Quality Management System Certification for Military Equipment. The company holds a total of 25 independent patented technologies, boasting complete production qualifications and R&D capabilities for military supporting projects.
Equipment
Technical Advantages
Connector Welding
Support multi-temperature gradient soldering processes including tin-lead, tin-silver-copper and gold-tin; compatible with various connectors such as insulators, SMP, SMPM/SSMP and multi-core connectors; hundreds of connectors can be welded on a single product simultaneously.
Substrate Soldering
Compatible with multiple substrates including 5880 boards, digital-analog composite organic boards and LTCC substrates; the void rate of soldering is normally ≤25%, and can be optimized to ≤20% under premium process control.
Chip Assembly (Eutectic Bonding / Adhesive Bonding)
Adopt various assembly processes including gold-germanium, gold-tin, high/low stress conductive adhesive and H20E conductive adhesive; applicable to Si, GaAs, GaN chips; the minimum assembly clearance reaches 50μm; the void rate of chip eutectic bonding is ≤10%, and can be optimized to ≤5%.
Bonding / Spot Welding
Support processing of 18/25/40μm gold wires, 100/200/300μm gold ribbons, enameled coils and beam leads; strictly control loop height consistency; the internal destructive bonding pull test standard is 1.5 times of the national military standard GJB548B.
Our Mission
Empower the microwave military industry with sophisticated micro-assembly processes, adhere to military quality standards, continuously innovate precision manufacturing technologies, provide customers with highly reliable one-stop OEM solutions, and strive to become a benchmark enterprise of domestic top-tier microwave micro-assembly.
